Engineering Change Notices

Capacitors
Resistive Products
Potentiometers & Encoders
Switches
RF Modules 		Ceramic Products
Inductors, Coils, Transformers
Audio Components
RoHS
Thermistors


Capacitors: Issue
Date
Ceramic: ECC & ECK Series **ENGINEERING CHANGE** 05/17/02
General Package Marking Change 01/20/00
ECJ Series MLCC Part Number Change to reflect an increased quantity per reel of certain Case 10/07/04
ECJ Series MLCC Part Number Change to reflect a higher rated voltage part to take the place of a lower rated part 10/07/04
MLCC: Change of 0201 MLCC (ECJ-ZExxxxxxx) Packaging Specifications 03/23/06
Film Cap: Radial leaded Aluminum Foil Film Capacitors, ECQ-B, ECQ-P, ECH-S, ECQ-M, ECQ-F Series - NCNR 01/05/08
Aluminum Foil Thickness **Engineering Change** 10/31/02
ECW-U(X)(C): Stacked Metallized PEN Film Chip Capacitor 06/01/06
Electrolytic: Change of sleeve material from PVC to PET in Radial Electrolytic Capacitors - ***Engineering Change*** 07/06/04
Large Can and
Screw Terminal:		 Changing Part Numbering System for Screw Terminal Type Electrolytic Capacitor
***Engineering Change Notice***		 07/08/04
SP-Cap: Tape Sealing Method Change
***Engineering Change Notice***		 10/15/07
Molding Resin Material Changing to Halogen-Free Type
***Engineering Change Notice***		 10/15/07
Standardization of Desiccant Packaging
***Engineering Change Notice***		 09/20/06


Resistive Products: Issue
Date
EMI Filters,
Arrays & Networks:		 Engineering Change Notice, 2 mode noise filter, EXC24CB/CP Series 02/02/05
Engineering Change Notice, Chip Bead Array, EXC228BB/BA Series 05/16/05
Resistors: ERG-1S & ERX-1S MarkingChange 03/20/01
EROS2PHFxxxx, ERDS2TJxxxV Packaging Qty. Change 07/25/03
ERJ-M Label Position Change 01/06/03


Potentiometers & Encoders: Issue
Date
Trimmers: EVN5ES/EVN5CES Material Change 02/03/00
Potentiometer: Part number change for particular Position Sensor from the EVAW7 product family. 03/20/06


Switches: Issue
Date
Light Touch: Part number change for particular Light Touch Switch from the EVQ-P6 product family. 08/04/07
Part number change for particular Light Touch Switch from the EVQ-QW/PJ/P1/PC product families. 05/18/06
Part number change for particular Light Touch Switches from the EVQ-QF product family. 03/20/06
EVQ Light Touch General Notice 12/24/98
EVQ11 Series of Light Touch Switches (LTSW) to change production location. 01/18/05
Power Switches: ESB-92S, ESB-92D, Push-type power switches are now not recommended for new designs. 10/30/06
Slide Switches: Slide switches are not recommended for new designs 10/22/07
Detector Switches: Part number change for particular ESE13 detector switch. 03/20/06
Part number change for particular Detector Switch from the ESE-21 product family. 03/20/06


RF Modules: Issue
Date
PAN802154HAR00: Product Specification change regarding corporate logo & factory location, of the 2.4GHz band LR-WPAN module (PAN802154HAR00) 06/14/06


Ceramic Products: Issue
Date
Surge Absorbers: EZJSxxxxxxZ **ENGINEERING CHANGE** 02/26/04


Inductors, Coils, Transformers, Filters: Issue
Date
Choke Coils Power Choke Coil ETQ-P6FxxxBFA Manufacturing Location Change 03/23/06
Power Choke Coil ETQ-P5LxxxXFA Manufacturing Location Change 03/23/06
ELK-UxxxFB (Packaging Material)
**ENGINEERING CHANGE**		 07/10/02
Inductors / Coils Additional Manufacturing Location of these 0402, & 0201 Case Size Chip Inductors; 0402 (RF, QF, PF) & 0201 (RG) Series 11/09/04
Filters ELF-21CxxxA, ELF-25CxxxA, and ELF-25CxxxF Manufacturing location change for Line Filter Series Types 05/23/06


Audio Components: Issue
Date
Microphones: Production Site Change for 6mm Microphones 01/24/05
Speakers: EAS-3P127A Speaker RoHS Compliance 07/24/06


RoHS: Issue
Date
Labeling: RoHS Compliance Labeling – JEITA Standard ET-7001 11/17/05


Thermistors: Issue
Date
Multi-Layer: Change of 0201 Multi-layer Thermistor (ERT-JZxxxxxxx) Packaging Specification 02/01/08